منابع مشابه
Compliant Tactile Sensors for High-Aspect-Ratio Form Metrology
Robust manufacturing of micro parts at high throughput needs tailored concepts and methods to assure unchanging work piece quality. An actual challenge is the dimensional metrology with meso-to-microscopic high-aspect ratio features of micro-system components, e.g. micro gears for watches and micro motors, ferrules of optical fibers, hollow microneedles for painless drug delivery into living ce...
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Micro-machined silicon needles capable of penetrating through cell membranes were fabricated and tested for intracellular sensing applications. The fabricated needles have sharp tips (diameter <1 μm), they are long (>300 μm) and exhibit high mechanical strength. The needles were tested for extraand intra-cellular neuronal recording applications. To prepare the needles for neuronal recording, th...
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We present a micro electromechanical tunable capacitor with a low control voltage, a wide tuning range and adequate electrical quality factor. The device is fabricated in a single-crystalline silicon layer using deep reactive ion etching (DRIE) for obtaining high-aspect ratio (> 20) parallel combdrive structures with vertical sidewalls. The process sequence for fabrication of the devices uses o...
متن کاملA new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding
This paper presents the development and characterization of a new high-aspect-ratio MEMS process. The silicon-on-silicon (SOS) process utilizes dielectric barrier discharge surface activated low-temperature wafer bonding and deep reactive ion etching to achieve a high aspect ratio (feature width reduction-to-depth ratio of 1:31), while allowing for the fabrication of devices with a very high an...
متن کاملManufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniques
The emphasis on high aspect ratio micromachining techniques for microsystems/MEMS has been mainly to achieve novel devices with, for example, high sensing or actuation performance. Often these utilize deep structures (100–1,000 lm) with vertical wall layers but with relatively modest spatial resolution (1–10 lm). As these techniques move from research to industrial manufacture, the capital cost...
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ژورنال
عنوان ژورنال: Microsystem Technologies
سال: 2004
ISSN: 0946-7076,1432-1858
DOI: 10.1007/s00542-004-0393-4